Team:HKU-HKBU/Motor Design

From 2009.igem.org

(Difference between revisions)
(New page: {{Team:HKU-HKBU/style.css}} {{Team:HKU-HKBU/script.js}} {{Team:HKU-HKBU/header}} ==Motor Production== ===Step 1 - Photoresist (SU-8) Spin Coating=== [[Image:HKU-HKBU_motor_production_1.p...)
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===Step 1 - Photoresist (SU-8) Spin Coating===
===Step 1 - Photoresist (SU-8) Spin Coating===
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[[Image:HKU-HKBU_motor_production_1.png | center]]
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[[Image:HKU-HKBU_motor_production_1.png | right|thumb]]
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Note:
Note:
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* Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating.
* Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating.
* Resist thickness is 1-2 mm.
* Resist thickness is 1-2 mm.
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===Step 2 - Alignment and Exposure===
===Step 2 - Alignment and Exposure===
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[[Image:HKU-HKBU_motor_production_2.png | center]]
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[[Image:HKU-HKBU_motor_production_2.png | right|thumb]]
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Note:
Note:
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* Normally requires at least two alignment mark sets on opposite sides of wafer or stepped region.
* Normally requires at least two alignment mark sets on opposite sides of wafer or stepped region.
* We use "deep ultraviolet", which is produced by excimer lasers, as light source.
* We use "deep ultraviolet", which is produced by excimer lasers, as light source.
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===Step 3 - Dry Etch===
===Step 3 - Dry Etch===
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[[Image:HKU-HKBU_motor_production_3.png | center]]
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[[Image:HKU-HKBU_motor_production_3.png | right|thumb]]
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Note:
Note:
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===Step 4 - Photoresist (SU-8) Spin Coating===
===Step 4 - Photoresist (SU-8) Spin Coating===
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[[Image:HKU-HKBU_motor_production_4.png | center]]
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[[Image:HKU-HKBU_motor_production_4.png | right |thumb]]
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Note:
Note:
Please refer to [[#Step_1_-_Photoresist_(SU-8)_Spin_Coating | step 1]].
Please refer to [[#Step_1_-_Photoresist_(SU-8)_Spin_Coating | step 1]].
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===Step 5 - Alignment and Exposure===
===Step 5 - Alignment and Exposure===
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[[Image:HKU-HKBU_motor_production_mask.png | center]]
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[[Image:HKU-HKBU_motor_production_mask.png | right |thumb]]
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[[Image:HKU-HKBU_motor_production_5.png | center]]
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[[Image:HKU-HKBU_motor_production_5.png | right |thumb]]
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Note:
Note:
Please refer to [[#Step_2_-_Alignment_and_Exposure | step 2]].
Please refer to [[#Step_2_-_Alignment_and_Exposure | step 2]].
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===Step 6 - Silver Plating===
===Step 6 - Silver Plating===
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[[Image:HKU-HKBU_motor_production_6.png | center]]
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[[Image:HKU-HKBU_motor_production_6.png | right |thumb]]
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Note:
Note:
* A silver coating is plated onto the “primary motor”, which is around 50µm thick.
* A silver coating is plated onto the “primary motor”, which is around 50µm thick.
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===Step 7 - Photoresist Removal (Stripping)===
===Step 7 - Photoresist Removal (Stripping)===
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[[Image:HKU-HKBU_motor_production_7.png | center]]
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[[Image:HKU-HKBU_motor_production_7.png | right |thumb]]
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Note:
Note:
* The aim is to remove the photoresist and any of its residues.
* The aim is to remove the photoresist and any of its residues.
* We use Hydrofluoric acid to remove the photoresist (SU-8). While it is extremely corrosive and difficult to handle, it is technically a weak acid. It can react with SiO2 and SU-8 and dissolve them, while, it cannot react with silver (Ag). Thus, we get the motor with one side coated with Ag, while the other side is not. At the same time, the substrate SiO2 has also been removed, only remaining the motors.
* We use Hydrofluoric acid to remove the photoresist (SU-8). While it is extremely corrosive and difficult to handle, it is technically a weak acid. It can react with SiO2 and SU-8 and dissolve them, while, it cannot react with silver (Ag). Thus, we get the motor with one side coated with Ag, while the other side is not. At the same time, the substrate SiO2 has also been removed, only remaining the motors.
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===Step 8 - Biotin Binding===
===Step 8 - Biotin Binding===

Revision as of 20:12, 17 October 2009

Contents

Motor Production

Step 1 - Photoresist (SU-8) Spin Coating

HKU-HKBU motor production 1.png


Note:

  • Typical contaminants that must be removed prior to photoresist (SU-8) coating.
  • Adhesion promoters are used to assist resist coating.
  • Ideally want no H2O on wafer surface.
  • Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating.
  • Resist thickness is 1-2 mm.


Step 2 - Alignment and Exposure

HKU-HKBU motor production 2.png


Note:

  • For simple contact, proximity, and projection systems, the mask is the same size and scale as the printed wafer pattern.
  • Projection systems give the ability to change the reproduction ratio. Going to 10:1 reduction allows larger size patterns on the mask, which is more robust to mask defects.
  • Normally requires at least two alignment mark sets on opposite sides of wafer or stepped region.
  • We use "deep ultraviolet", which is produced by excimer lasers, as light source.


Step 3 - Dry Etch

HKU-HKBU motor production 3.png


Note:

  • Dry Etching is an etching process that does not utilize any liquid chemicals or etchants to remove materials from the wafer, generating only volatile byproducts in the process.
  • Dry etching may be accomplished by any of the following: 1) through chemical reactions that consume the material, using chemically reactive gases or plasma; 2) physical removal of the material, usually by momentum transfer; or 3) a combination of both physical removal and chemical reactions.
  • In this project, we use chemically reactive gases to consume Si.

Step 4 - Photoresist (SU-8) Spin Coating

HKU-HKBU motor production 4.png


Note:

Please refer to step 1.


Step 5 - Alignment and Exposure

HKU-HKBU motor production mask.png
HKU-HKBU motor production 5.png


Note:

Please refer to step 2.


Step 6 - Silver Plating

HKU-HKBU motor production 6.png


Note:

  • A silver coating is plated onto the “primary motor”, which is around 50µm thick.


Step 7 - Photoresist Removal (Stripping)

HKU-HKBU motor production 7.png


Note:

  • The aim is to remove the photoresist and any of its residues.
  • We use Hydrofluoric acid to remove the photoresist (SU-8). While it is extremely corrosive and difficult to handle, it is technically a weak acid. It can react with SiO2 and SU-8 and dissolve them, while, it cannot react with silver (Ag). Thus, we get the motor with one side coated with Ag, while the other side is not. At the same time, the substrate SiO2 has also been removed, only remaining the motors.



Step 8 - Biotin Binding

Biotin can only bind on the silver (Ag) side, while the other side (Si) will have no biotin.

Sponsors

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