Team:HKU-HKBU/Motor Design

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Please refer to [[Team:HKU-HKBU/Motor_Silicon_Version#Step_1:_Photoresist_.28SU-8.29_Spin_Coating|step1]].
===Step 5: Alignment and Exposure===
===Step 5: Alignment and Exposure===

Revision as of 06:02, 21 October 2009

Contents

Silicon Version

For Version 1, the size of motor is somewhat larger than we have expected. The size of an E. coli is about 0.8μm and consequently the motor should have a size of approximately 50μm in order to match with the bacteria in dimentions. However, the precision of Leica-crytomicrotome is around 50μm, which is just the size of motor. We need to search for more sophiscated methods to produce motor.

We decide to choose silicon as the material for motor. The micro-fabrication means of photolithography [Link 2] is used to create the motor. The precision of photolithography is 2μm, which is adequate to serve our purpose. The main steps of motor production are listed as follows:

Step 1: Photoresist (SU-8) Spin Coating

HKU-HKBU motor production 1.png

Remarks:

  1. Typical contaminants must be removed prior to photoresist (SU-8) coating.
  2. Adhesion promoters are used to assist resist-coating.
  3. Ideally, no water is allowed on wafer surface.
  4. Wafer is held on a spinner chuck by vacuum. Resist is coated to uniform thickness by spin coating.
  5. Resist thickness is 1-2 mm.

Step 2: Alignment and Exposure

HKU-HKBU motor production 2.png

Remarks:

  1. For simple contact, proximity, and projection systems, the mask is the same in size and scale as those of the printed wafer pattern.
  2. Projection systems give the ability to change the reproduction ratio. Adjusting to 10:1 reduction allows larger size patterns on the mask, which is more robust to mask defects.
  3. Normally requires at least two alignment mark sets on opposite sides of wafer or stepped region.
  4. We use "deep ultraviolet", which is produced by excimer lasers, as light source.

Step 3: Dry Etch

HKU-HKBU motor production 3.png

Note:

  1. Dry Etching is an etching process that does not utilize any liquid chemicals or etchants to remove materials from the wafer.Only volatile byproducts are generated in the process.
  2. In this project, we use chemically reactive gases to consume silicon.
  3. Dry etching may be accomplished by any of the following choices:
    • Chemical reactions using chemically reactive gases or plasma to consume the material
    • Physical removal of the material, usually by momentum transfer
    • Combination of both physical and chemical removal method

Step 4: Photoresist (SU-8) Spin Coating

HKU-HKBU motor production 4.png

Note: Please refer to step1.

Step 5: Alignment and Exposure

HKU-HKBU motor production mask.png
HKU-HKBU motor production 5.png

Note: Please refer to Step 2.

Step 6: Silver Plating

HKU-HKBU motor production 6.png

Note: A silver coating is plated onto the “primary motor”, which is around 50μm thick.

Step 7: Photoresist Removal (Stripping)

HKU-HKBU motor production 7.png

Note:

  1. The aim is to eliminate photoresist(SU-8) .
  2. We use hydrofluoric acid to remove the photoresist (SU-8). While it is extremely corrosive and difficult to handle, it is technically a weak acid. It can react with SiO2 and SU-8 and dissolve them, but it cannot react with silver (Ag). We thus coat one side of the motor with silver and leave the other side uncoated. At the same time, the substrate SiO2 has also been removed.

Step 8: Biotin Binding

Biotin can only bind on the silver (Ag) side, while the other side (Si) will have no biotin.

Previously, we have designed four kinds of motor with different shapes, which are shown in the figure below. The red lines in the figure represent the biotin binding sides.

HKU-HKBU motor production 8.png

Our final design is shown below. The red lines in the figure represent the biotin binding sides.

HKU-HKBU motor production 9.png

The force exerted by bacteria on the motor is proportional to R. The rotational motility of the motor is proportional to 1/R3.The smaller size allows a larger angular speed.

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