http://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&feed=atom&action=historyTeam:HKU-HKBU/Protocols - Revision history2024-03-28T20:53:06ZRevision history for this page on the wikiMediaWiki 1.16.5http://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=139675&oldid=prevFuXF: /* Photolithography */2009-10-21T07:37:05Z<p><span class="autocomment">Photolithography</span></p>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>##** xylene</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>##** xylene</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Coating (Spin Casting)</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Coating (Spin Casting)</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#* Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating. Resist thickness is set by primarily resist viscosity and secondarily spinner rotational speed. Most resist thicknesses are 1-2 mm for commercial Si processes. [[Image:HKU-HKBU_Photolithography_figure_1.png | <del class="diffchange diffchange-inline">frame </del>| center | 300px | Fig 1 Photoresist Spin Coating]] [[Image:HKU-HKBU_Photolithography_figure_2.png | <del class="diffchange diffchange-inline">frame </del>| center | 300px | Fig 2 Stages of Resist Coating]]</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>#* Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating. Resist thickness is set by primarily resist viscosity and secondarily spinner rotational speed. Most resist thicknesses are 1-2 mm for commercial Si processes.</div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_1.png | <ins class="diffchange diffchange-inline">thumb </ins>| center | 300px | Fig 1 Photoresist Spin Coating]] [[Image:HKU-HKBU_Photolithography_figure_2.png | <ins class="diffchange diffchange-inline">thumb </ins>| center | 300px | Fig 2 Stages of Resist Coating]]</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Pre-Bake (Soft Bake)</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Pre-Bake (Soft Bake)</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#* Pre-bake is used to evaporate the coating solvent and to densify the resist after spin coating. Commercially, microwave heating or IR lamps are also used in production lines. Hot plating the resist is usually faster, more controllable, and does not trap solvent like convection oven baking. [[Image:HKU-HKBU_Photolithography_figure_3.png | <del class="diffchange diffchange-inline">frame </del>| center | Fig 3 Soft Bake]]</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>#* Pre-bake is used to evaporate the coating solvent and to densify the resist after spin coating. Commercially, microwave heating or IR lamps are also used in production lines. Hot plating the resist is usually faster, more controllable, and does not trap solvent like convection oven baking. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Alignment [[Image:HKU-HKBU_Photolithography_figure_4.png | <del class="diffchange diffchange-inline">frame </del>| center | Fig 4 Overview of Align/Expose/Develop Steps]]</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_3.png | <ins class="diffchange diffchange-inline">thumb </ins>| center <ins class="diffchange diffchange-inline">| 300px </ins>| Fig 3 Soft Bake]]</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Exposure [[Image:HKU-HKBU_Photolithography_figure_5.png | <del class="diffchange diffchange-inline">frame </del>| center | Fig 5 Exposure ("printing") systems]]</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Alignment </div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_4.png | <ins class="diffchange diffchange-inline">thumb </ins>| center<ins class="diffchange diffchange-inline">| 300px </ins>| Fig 4 Overview of Align/Expose/Develop Steps]]</div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Exposure </div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_5.png | <ins class="diffchange diffchange-inline">thumb </ins>| center <ins class="diffchange diffchange-inline">| 300px </ins>| Fig 5 Exposure ("printing") systems]]</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* For simple contact, proximity, and projection systems, the mask is the same size and scale as the printed wafer pattern. I.e. the reproduction ratio is 1:1.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* For simple contact, proximity, and projection systems, the mask is the same size and scale as the printed wafer pattern. I.e. the reproduction ratio is 1:1.</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Projection systems give the ability to change the reproduction ratio. Going to 10:1 reduction allows larger size patterns on the mask, which is more robust to mask defects.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Projection systems give the ability to change the reproduction ratio. Going to 10:1 reduction allows larger size patterns on the mask, which is more robust to mask defects.</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Subtractive -> etching</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Subtractive -> etching</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Modifying -> doping, annealing, or curing</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Modifying -> doping, annealing, or curing</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_6.png | <del class="diffchange diffchange-inline">frame </del>| center | Fig 6 Microfabrication Processes]]</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_6.png | <ins class="diffchange diffchange-inline">thumb </ins>| center <ins class="diffchange diffchange-inline">| 300px </ins>| Fig 6 Microfabrication Processes]]</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>'''Two primary techniques for patterning additive and subtractive processes'''</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>'''Two primary techniques for patterning additive and subtractive processes'''</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* unwanted material is lifted off when resist is removed</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* unwanted material is lifted off when resist is removed</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_7.png | thumb | center| 300px | Fig 7 Etch-back]]</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_7.png | thumb | center| 300px | Fig 7 Etch-back]]</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_8.png | thumb | center | Fig 8 Lift-off]]</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_8.png |thumb | center <ins class="diffchange diffchange-inline">| 300px </ins>| Fig 8 Lift-off]]</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td></tr>
</table>FuXFhttp://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=139642&oldid=prevFuXF: /* Photolithography */2009-10-21T07:34:20Z<p><span class="autocomment">Photolithography</span></p>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>##** xylene</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>##** xylene</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Coating (Spin Casting)</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Coating (Spin Casting)</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#* Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating. Resist thickness is set by primarily resist viscosity and secondarily spinner rotational speed. Most resist thicknesses are 1-2 mm for commercial Si processes. [[Image:HKU-HKBU_Photolithography_figure_1.png | frame | center | Fig 1 Photoresist Spin Coating]] [[Image:HKU-HKBU_Photolithography_figure_2.png | frame | center | Fig 2 Stages of Resist Coating]]</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>#* Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating. Resist thickness is set by primarily resist viscosity and secondarily spinner rotational speed. Most resist thicknesses are 1-2 mm for commercial Si processes. [[Image:HKU-HKBU_Photolithography_figure_1.png | frame | center <ins class="diffchange diffchange-inline">| 300px </ins>| Fig 1 Photoresist Spin Coating]] [[Image:HKU-HKBU_Photolithography_figure_2.png | frame | center <ins class="diffchange diffchange-inline">| 300px </ins>| Fig 2 Stages of Resist Coating]]</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Pre-Bake (Soft Bake)</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Pre-Bake (Soft Bake)</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Pre-bake is used to evaporate the coating solvent and to densify the resist after spin coating. Commercially, microwave heating or IR lamps are also used in production lines. Hot plating the resist is usually faster, more controllable, and does not trap solvent like convection oven baking. [[Image:HKU-HKBU_Photolithography_figure_3.png | frame | center | Fig 3 Soft Bake]]</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Pre-bake is used to evaporate the coating solvent and to densify the resist after spin coating. Commercially, microwave heating or IR lamps are also used in production lines. Hot plating the resist is usually faster, more controllable, and does not trap solvent like convection oven baking. [[Image:HKU-HKBU_Photolithography_figure_3.png | frame | center | Fig 3 Soft Bake]]</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* patterned layer is deposited over top of the photoresist</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* patterned layer is deposited over top of the photoresist</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* unwanted material is lifted off when resist is removed</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* unwanted material is lifted off when resist is removed</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_7.png | <del class="diffchange diffchange-inline">frame </del>| center | Fig 7 Etch-back]]</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_7.png | <ins class="diffchange diffchange-inline">thumb </ins>| center<ins class="diffchange diffchange-inline">| 300px </ins>| Fig 7 Etch-back]]</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_8.png | <del class="diffchange diffchange-inline">frame </del>| center | Fig 8 Lift-off]]</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_8.png | <ins class="diffchange diffchange-inline">thumb </ins>| center | Fig 8 Lift-off]]</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td></tr>
</table>FuXFhttp://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=138666&oldid=prevYinanZhang at 05:40, 21 October 20092009-10-21T05:40:34Z<p></p>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>** Film over-exposure or lack of exposure</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>** Film over-exposure or lack of exposure</div></td></tr>
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<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div><del class="diffchange diffchange-inline">=</del>=Reference<del class="diffchange diffchange-inline">=</del>=</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>=Reference=</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Watt RM, Wang J, Leong M, Kung HF, Cheah KS, Liu D, Danchin A, Huang JD. Visualizing the proteome of Escherichia coli: an efficient and versatile method for labeling chromosomal coding DNA sequences (CDSs) with fluorescent protein genes. Nucleic Acids Res. 2007, 35(6):e37.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Watt RM, Wang J, Leong M, Kung HF, Cheah KS, Liu D, Danchin A, Huang JD. Visualizing the proteome of Escherichia coli: an efficient and versatile method for labeling chromosomal coding DNA sequences (CDSs) with fluorescent protein genes. Nucleic Acids Res. 2007, 35(6):e37.</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># R. B. Darling / EE-527</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># R. B. Darling / EE-527</div></td></tr>
</table>YinanZhanghttp://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=138659&oldid=prevYinanZhang at 05:39, 21 October 20092009-10-21T05:39:43Z<p></p>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>Photolithography is an optical means for transferring patterns onto a substrate. It is essentially the same process that is used in lithographic printing. Patterns are first transferred to an imagable photoresist layer. Photoresist is a liquid film that can be spread out onto a substrate, exposed with a desired pattern, and developed into a selectively placed layer for subsequent processing.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>Photolithography is an optical means for transferring patterns onto a substrate. It is essentially the same process that is used in lithographic printing. Patterns are first transferred to an imagable photoresist layer. Photoresist is a liquid film that can be spread out onto a substrate, exposed with a desired pattern, and developed into a selectively placed layer for subsequent processing.</div></td></tr>
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<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>Overview of the photolithography process</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">'''</ins>Overview of the photolithography process<ins class="diffchange diffchange-inline">'''</ins></div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Surface Preparation</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Surface Preparation</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>##** silicone</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>##** silicone</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>## Wafer priming: Adhesion promoters are used to assist resist coating. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>## Wafer priming: Adhesion promoters are used to assist resist coating. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#* Resist adhesion factors:</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#* Resist adhesion factors:</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** moisture content on surface</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** moisture content on surface</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** wetting characteristics of resist</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** wetting characteristics of resist</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** type of primer</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** type of primer</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** delay in exposure and prebake</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** delay in exposure and prebake</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** resist chemistry</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** resist chemistry</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** surface smoothness</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** surface smoothness</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** stress from coating process</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** stress from coating process</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** surface contamination</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** surface contamination</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#* Wafer primers</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#* Wafer primers</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** Used for silicon:</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** Used for silicon:</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#*** primers form bonds with surface and produce a polar (electrostatic) surface</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#*** primers form bonds with surface and produce a polar (electrostatic) surface</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#*** most are based upon siloxane linkages (Si-O-Si)</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#*** most are based upon siloxane linkages (Si-O-Si)</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** 1,1,1,3,3,3-hexamethyldisilazane (HMDS), (CH3)3SiNHSi(CH3)3</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** 1,1,1,3,3,3-hexamethyldisilazane (HMDS), (CH3)3SiNHSi(CH3)3</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** trichlorophenylsilane (TCPS), C6H5SiCl3</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** trichlorophenylsilane (TCPS), C6H5SiCl3</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** bistrimethylsilylacetamide (BSA), (CH3)3SiNCH3COSi(CH3)3</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** bistrimethylsilylacetamide (BSA), (CH3)3SiNCH3COSi(CH3)3</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** Used for gallium arsenide:</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** Used for gallium arsenide:</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#*** GaAs already has a polar surface</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#*** GaAs already has a polar surface</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** monazoline C</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** monazoline C</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** trichlorobenzene</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** trichlorobenzene</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#** xylene</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">#</ins>#** xylene</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Coating (Spin Casting)</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Coating (Spin Casting)</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating. Resist thickness is set by primarily resist viscosity and secondarily spinner rotational speed. Most resist thicknesses are 1-2 mm for commercial Si processes. [[Image:HKU-HKBU_Photolithography_figure_1.png | frame | center | Fig 1 Photoresist Spin Coating]] [[Image:HKU-HKBU_Photolithography_figure_2.png | frame | center | Fig 2 Stages of Resist Coating]]</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating. Resist thickness is set by primarily resist viscosity and secondarily spinner rotational speed. Most resist thicknesses are 1-2 mm for commercial Si processes. [[Image:HKU-HKBU_Photolithography_figure_1.png | frame | center | Fig 1 Photoresist Spin Coating]] [[Image:HKU-HKBU_Photolithography_figure_2.png | frame | center | Fig 2 Stages of Resist Coating]]</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Post Processing Cleaning (Ashing)</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Post Processing Cleaning (Ashing)</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>Light Sources</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">'''</ins>Light Sources<ins class="diffchange diffchange-inline">'''</ins></div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Ultraviolet light from gas-discharge lamps</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Ultraviolet light from gas-discharge lamps</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># High-index immersion lithography (193nm)</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># High-index immersion lithography (193nm)</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>Basics of Photolithography for Processing</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">'''</ins>Basics of Photolithography for Processing<ins class="diffchange diffchange-inline">'''</ins></div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Additive -> deposition</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Additive -> deposition</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_6.png | frame | center | Fig 6 Microfabrication Processes]]</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>[[Image:HKU-HKBU_Photolithography_figure_6.png | frame | center | Fig 6 Microfabrication Processes]]</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>Two primary techniques for patterning additive and subtractive processes<del class="diffchange diffchange-inline">:</del></div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline">'''</ins>Two primary techniques for patterning additive and subtractive processes<ins class="diffchange diffchange-inline">'''</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div> </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Etch-back:</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Etch-back:</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* photoresist is applied overtop of the layer to be patterned</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* photoresist is applied overtop of the layer to be patterned</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Bruce W. Smith, "Resist Processing" in James R. Sheats and Bruce W. Smith eds., "Microlithography", Marcel Dekker (1998)</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Bruce W. Smith, "Resist Processing" in James R. Sheats and Bruce W. Smith eds., "Microlithography", Marcel Dekker (1998)</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># SEMI technical program, Semicon Europa (1996)</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># SEMI technical program, Semicon Europa (1996)</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div><del style="color: red; font-weight: bold; text-decoration: none;"></del></div></td><td colspan="2"> </td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>{{Team:HKU-HKBU/footer}}</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>{{Team:HKU-HKBU/footer}}</div></td></tr>
</table>YinanZhanghttp://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=138418&oldid=prevYinanZhang at 05:00, 21 October 20092009-10-21T05:00:47Z<p></p>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Place the membrane on a piece of filter paper.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Place the membrane on a piece of filter paper.</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Air dry for 15 minutes.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Air dry for 15 minutes.</div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"><gallery align="center"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Image:HKU-HKBU_motor_results_1.png</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Image:HKU-HKBU_motor_results_2.png</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Image:HKU-HKBU_motor_results_3.png</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Image:HKU-HKBU_motor_results_4.png</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Image:HKU-HKBU_motor_results_5.png</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Image:HKU-HKBU_motor_results_6.png</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></gallery></ins></div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Pre-culture==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Pre-culture==</div></td></tr>
</table>YinanZhanghttp://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=138312&oldid=prevYinanZhang at 04:44, 21 October 20092009-10-21T04:44:28Z<p></p>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Photolithography==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Photolithography==</div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">The motors are fabricated by using a general surface manufacturing process for Si and SiO2. The motor bodies are made by reactive ion etching of thermal SiO2 layer on a Si substrate with a mask. Then the Si under the motors is anisotropically etched by wet etching, so that the motors are tethered to the Si base by two thin bridges designed to break upon sonication.</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Photolithography is an optical means for transferring patterns onto a substrate. It is essentially the same process that is used in lithographic printing. Patterns are first transferred to an imagable photoresist layer. Photoresist is a liquid film that can be spread out onto a substrate, exposed with a desired pattern, and developed into a selectively placed layer for subsequent processing.</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Overview of the photolithography process</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Surface Preparation</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">## Typical contaminants that must be removed prior to photoresist coating:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* dust from scribing or cleaving (minimized by laser scribing)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* atmospheric dust (minimized by good clean room practice)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* abrasive particles (from lapping or CMP)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* lint from wipers (minimized by using lint-free wipers)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* photoresist residue from previous photolithography (minimized by performing oxygen plasma ashing)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* bacteria (minimized by good DI water system)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* films from other sources:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##** solvent residue</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##** H2O residue</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##** photoresist or developer residue</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##** oil</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##** silicone</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">## Wafer priming: Adhesion promoters are used to assist resist coating. </ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* Resist adhesion factors:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** moisture content on surface</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** wetting characteristics of resist</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** type of primer</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** delay in exposure and prebake</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** resist chemistry</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** surface smoothness</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** stress from coating process</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** surface contamination</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* Wafer primers</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** Used for silicon:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#*** primers form bonds with surface and produce a polar (electrostatic) surface</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#*** most are based upon siloxane linkages (Si-O-Si)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** 1,1,1,3,3,3-hexamethyldisilazane (HMDS), (CH3)3SiNHSi(CH3)3</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** trichlorophenylsilane (TCPS), C6H5SiCl3</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** bistrimethylsilylacetamide (BSA), (CH3)3SiNCH3COSi(CH3)3</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** Used for gallium arsenide:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#*** GaAs already has a polar surface</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** monazoline C</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** trichlorobenzene</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#** xylene</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Coating (Spin Casting)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* Wafer is held on a spinner chuck by vacuum and resist is coated to uniform thickness by spin coating. Resist thickness is set by primarily resist viscosity and secondarily spinner rotational speed. Most resist thicknesses are 1-2 mm for commercial Si processes. [[Image:HKU-HKBU_Photolithography_figure_1.png | frame | center | Fig 1 Photoresist Spin Coating]] [[Image:HKU-HKBU_Photolithography_figure_2.png | frame | center | Fig 2 Stages of Resist Coating]]</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Pre-Bake (Soft Bake)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* Pre-bake is used to evaporate the coating solvent and to densify the resist after spin coating. Commercially, microwave heating or IR lamps are also used in production lines. Hot plating the resist is usually faster, more controllable, and does not trap solvent like convection oven baking. [[Image:HKU-HKBU_Photolithography_figure_3.png | frame | center | Fig 3 Soft Bake]]</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Alignment [[Image:HKU-HKBU_Photolithography_figure_4.png | frame | center | Fig 4 Overview of Align/Expose/Develop Steps]]</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Exposure [[Image:HKU-HKBU_Photolithography_figure_5.png | frame | center | Fig 5 Exposure ("printing") systems]]</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* For simple contact, proximity, and projection systems, the mask is the same size and scale as the printed wafer pattern. I.e. the reproduction ratio is 1:1.</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* Projection systems give the ability to change the reproduction ratio. Going to 10:1 reduction allows larger size patterns on the mask, which is more robust to mask defects.</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* Mask size can get unwieldy for large wafers.</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* Most wafers contain an array of the same pattern, so only one cell of the array is needed on the mask. This system is called Direct Step on Wafer (DSW). These machines are also called “Steppers”. </ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Development</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">## Types:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* photographic emulsion on soda lime glass (cheapest)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* Fe2O3 on soda lime glass</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* Cr on soda lime glass</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* Cr on quartz glass (most expensive, needed for deep UV litho)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">## Dimensions:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* 4” x 4” x 0.060” for 3-inch wafers</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* 5” x 5” x 0.060” for 4-inch wafers</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">## Polarity:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* "light-field" = mostly clear, drawn feature = opaque</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">##* "dark-field" = mostly opaque, drawn feature = clear </ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#*Normally, this process requires at least two alignment mark sets on opposite sides of wafer or stepped region.</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Post-Bake (Hard Bake)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* Post bake is used to stabilize and harden the developed photoresist prior to processing steps that the resist will mask. The main parameter of this process is the plastic flow or glass transition temperature. It can remove any remaining traces of the coating solvent or developer. Also, it eliminates the solvent burst effects in vacuum processing. Post-bake introduces some stress into the photoresist and some shrinkage of the photoresist may occur. Longer or hotter post-bake makes resist removal much more difficult. </ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Processing Using the Photoresist as a Masking Film</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* Photoresist will undergo plastic flow with sufficient time and/or temperature.</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Stripping</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* This process is to remove the photoresist and any of its residues. Simple solvents are generally sufficient for non-postbaked photoresists. There are two kinds of photoresist, i.e. positive photoresist and negative photoresist. Besides, plasma etching with O2 (ashing) is also effective for removing organic polymer debris.</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Post Processing Cleaning (Ashing)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Light Sources</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Ultraviolet light from gas-discharge lamps</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># "deep ultraviolet", produced by excimer lasers</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Immersion lithography with numerical apertures</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># High-index immersion lithography (193nm)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Basics of Photolithography for Processing</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Additive -> deposition</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Subtractive -> etching</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Modifying -> doping, annealing, or curing</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">[[Image:HKU-HKBU_Photolithography_figure_6.png | frame | center | Fig 6 Microfabrication Processes]]</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">Two primary techniques for patterning additive and subtractive processes:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Etch-back:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* photoresist is applied overtop of the layer to be patterned</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* unwanted material is etched away</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"># Lift-off:</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* patterned layer is deposited over top of the photoresist</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">#* unwanted material is lifted off when resist is removed</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">[[Image:HKU-HKBU_Photolithography_figure_7.png | frame | center | Fig 7 Etch-back]]</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">[[Image:HKU-HKBU_Photolithography_figure_8.png | frame | center | Fig 8 Lift-off]]</ins></div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td></tr>
</table>YinanZhanghttp://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=137930&oldid=prevYinanZhang at 04:00, 21 October 20092009-10-21T04:00:48Z<p></p>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Add 3~5mL LB broth to the tube and the specific resistance.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Add 3~5mL LB broth to the tube and the specific resistance.</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Culture overnight at 32 centigrade degree or 37°C.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Culture overnight at 32 centigrade degree or 37°C.</div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;"></ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins style="color: red; font-weight: bold; text-decoration: none;">==Photolithography==</ins></div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Reference==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Reference==</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Watt RM, Wang J, Leong M, Kung HF, Cheah KS, Liu D, Danchin A, Huang JD. Visualizing the proteome of Escherichia coli: an efficient and versatile method for labeling chromosomal coding DNA sequences (CDSs) with fluorescent protein genes. Nucleic Acids Res. 2007, 35(6):e37. </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Watt RM, Wang J, Leong M, Kung HF, Cheah KS, Liu D, Danchin A, Huang JD. Visualizing the proteome of Escherichia coli: an efficient and versatile method for labeling chromosomal coding DNA sequences (CDSs) with fluorescent protein genes. Nucleic Acids Res. 2007, 35(6):e37.</div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline"># R. B. Darling / EE-527</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline"># Bruce W. Smith, "Resist Processing" in James R. Sheats and Bruce W. Smith eds., "Microlithography", Marcel Dekker (1998)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div><ins class="diffchange diffchange-inline"># SEMI technical program, Semicon Europa (1996)</ins></div></td></tr>
<tr><td colspan="2"> </td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div> </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>{{Team:HKU-HKBU/footer}}</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>{{Team:HKU-HKBU/footer}}</div></td></tr>
</table>YinanZhanghttp://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=126094&oldid=prevJqq1002 at 08:53, 20 October 20092009-10-20T08:53:17Z<p></p>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*## Caution (Remind): use some special marks to distinguish the sterilized materials from the unsterilized ones. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*## Caution (Remind): use some special marks to distinguish the sterilized materials from the unsterilized ones. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Preparation after sterilization </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Preparation after sterilization </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*## Chill the 10%Glycerin to <del class="diffchange diffchange-inline">4 centigrade degree </del></div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*## Chill the 10%Glycerin to <ins class="diffchange diffchange-inline">4°C. </ins></div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*## Decant LB containing agar into the plates.(If antibiotics are necessary, be sure that they are added when the media temperature is below <del class="diffchange diffchange-inline">60 centigrade degree</del>.) </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*## Decant LB containing agar into the plates.(If antibiotics are necessary, be sure that they are added when the media temperature is below <ins class="diffchange diffchange-inline">60°C</ins>.) </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*# Streak the prepared strains onto the agar plates. Then incubate it at <del class="diffchange diffchange-inline">37? </del>for 10-16 hours. </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*# Streak the prepared strains onto the agar plates. Then incubate it at <ins class="diffchange diffchange-inline">37°C </ins>for 10-16 hours. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*# Pick up one single colony from the plate and pre-culture it overnight<del class="diffchange diffchange-inline">()</del></div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*# Pick up one single colony from the plate and pre-culture it overnight</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Take 0.5mL overnight culture to 50mL LB bottle. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Take 0.5mL overnight culture to 50mL LB bottle. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*# 37<del class="diffchange diffchange-inline">? </del>shaking 100~120 min to O.D. (wavelength 600) 0.45~0.6 </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*# 37 <ins class="diffchange diffchange-inline">centigrade degree </ins>shaking 100~120 min to O.D. (wavelength 600) 0.45~0.6 </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# On ice for 30min </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# On ice for 30min </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*# 4000rpm 7min at 4<del class="diffchange diffchange-inline">? </del></div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*# 4000rpm<ins class="diffchange diffchange-inline">, </ins>7min at 4 <ins class="diffchange diffchange-inline">centigrade degree </ins></div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Add origin volume 10% glycerol, suspend softly. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Add origin volume 10% glycerol, suspend softly. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Repeat the step 7,8 </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Repeat the step 7,8 </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Add origin volume 1/10 10% glycerol, suspend softly. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Add origin volume 1/10 10% glycerol, suspend softly. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*# <del class="diffchange diffchange-inline">4000rpm7 </del>min at 4<del class="diffchange diffchange-inline">?</del></div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*# <ins class="diffchange diffchange-inline">4000rpm, 7 </ins>min at 4 <ins class="diffchange diffchange-inline">centigrade degree </ins></div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*# Add origin volume 1/100 10% glycerol, suspend softly, store at -<del class="diffchange diffchange-inline">80?</del>.</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*# Add origin volume 1/100 10% glycerol, suspend softly, store at -<ins class="diffchange diffchange-inline">80°C</ins>.</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Electro Transformation==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Electro Transformation==</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Hold competent cells (from -80<del class="diffchange diffchange-inline">? </del>refrigerator) on ice. </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Hold competent cells (from -80 <ins class="diffchange diffchange-inline">centigrade degree </ins>refrigerator) on ice. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Gently mix ligation product (1-5 µL) with cells. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Gently mix ligation product (1-5 µL) with cells. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Transfer the cell/DNA mix into an electroporation cuvette.<del class="diffchange diffchange-inline"><br /></del>Note: the gene pulser should already be set properly</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Transfer the cell/DNA mix into an electroporation cuvette. <ins class="diffchange diffchange-inline">(</ins>Note: the gene pulser should already be set properly<ins class="diffchange diffchange-inline">)</ins></div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#* <del class="diffchange diffchange-inline">time </del>constant = 4.5 - 5.0 ms</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>#* <ins class="diffchange diffchange-inline">Time </ins>constant = 4.5 - 5.0 ms</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#* <del class="diffchange diffchange-inline">resistance </del>= 200 W</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>#* <ins class="diffchange diffchange-inline">Resistance </ins>= 200 W</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#* <del class="diffchange diffchange-inline">capacitance </del>= 25 mFD for 0.1 cm gap cuvettes, set the volts to 1.8 kV</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>#* <ins class="diffchange diffchange-inline">Capacitance </ins>= 25 mFD for 0.1 cm gap cuvettes, set the volts to 1.8 kV</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Pulse the cells once; the voltage display blinks, and the gene pulser beeps</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Pulse the cells once; the voltage display blinks, and the gene pulser beeps</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Quickly transfer <del class="diffchange diffchange-inline">37 ? </del>SOC to cuvette, mix by gently pipetting up and down, and transfer SOC/cells back to culture tube.</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Quickly transfer <ins class="diffchange diffchange-inline">37°C </ins>SOC to cuvette, mix by gently pipetting up and down, and transfer SOC/cells back to culture tube.</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Bath in <del class="diffchange diffchange-inline">37? </del>for 30~60 min. </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Bath in <ins class="diffchange diffchange-inline">37°C </ins>for 30~60 min. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Separate cells on petri-dishes, and cultivate them in <del class="diffchange diffchange-inline">37? </del>for 12-16 hours.</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Separate cells on petri-dishes, and cultivate them in <ins class="diffchange diffchange-inline">37°C </ins>for 12-16 hours.</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Ligation==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Ligation==</div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Add 10 × ligase buffers. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Add 10 × ligase buffers. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Add 0.5 µL ligase per 10 µL final volume. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Add 0.5 µL ligase per 10 µL final volume. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Bath in 16<del class="diffchange diffchange-inline">? </del>water for 12 hour, </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Bath in 16 <ins class="diffchange diffchange-inline">centigrade degree </ins>water for 12 hour, </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Begin transformation. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Begin transformation. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># One single colony is picked up from the agar plate and transferred to a tube.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># One single colony is picked up from the agar plate and transferred to a tube.</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Add 3~5mL LB broth to the tube and the specific resistance.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Add 3~5mL LB broth to the tube and the specific resistance.</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Culture overnight at 32<del class="diffchange diffchange-inline">? </del>or <del class="diffchange diffchange-inline">37?</del>.</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Culture overnight at 32 <ins class="diffchange diffchange-inline">centigrade degree </ins>or <ins class="diffchange diffchange-inline">37°C</ins>.</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Recombineering==</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#Overnight cultures: 5mL medium (containing antibiotic where applicable) from single colonies grown at 32°C for 18 h.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#Overnight cultures: 5mL medium (containing antibiotic where applicable) from single colonies grown at 32°C for 18 h.</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#Get 500uL from overnight cultures expanded into 50 ml of L medium in a 250 ml Erlenmeyer flask, and incubated at 32°C for <del class="diffchange diffchange-inline">2 h </del>(until OD600 of ca. 0.4–0.6). </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>#Get 500uL from overnight cultures expanded into 50 ml of L medium in a 250 ml Erlenmeyer flask, and incubated at 32°C for <ins class="diffchange diffchange-inline">2h </ins>(until OD600 of ca. 0.4–0.6). </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#Flasks were transferred to a shaking water bath at 42°C and incubated for 14–15 min, before cooling to 0°C as rapidly as possible in iced water. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#Flasks were transferred to a shaking water bath at 42°C and incubated for 14–15 min, before cooling to 0°C as rapidly as possible in iced water. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#After 15–20 min, cells were harvested by centrifugation at 0°C (4000 g, 9 min). </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#After 15–20 min, cells were harvested by centrifugation at 0°C (4000 g, 9 min). </div></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Loading buffer: 1ml stock + 0.2 ml DTT + Phenol Blue </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Loading buffer: 1ml stock + 0.2 ml DTT + Phenol Blue </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Sample treatment </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Sample treatment </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>#* <del class="diffchange diffchange-inline">centrifuge </del>the culture into pellet (13k rpm 10min)</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>#* <ins class="diffchange diffchange-inline">Centrifuge </ins>the culture into pellet (13k rpm 10min)</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Resuspend the pellet with 5xVolume(pellet) Resuspension buffer</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Resuspend the pellet with 5xVolume(pellet) Resuspension buffer</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Add 5xVolume(pellet) loading buffer </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>#* Add 5xVolume(pellet) loading buffer </div></td></tr>
</table>Jqq1002http://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=126028&oldid=prevJqq1002 at 08:46, 20 October 20092009-10-20T08:46:00Z<p></p>
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<td colspan='2' style="background-color: white; color:black;">Revision as of 08:46, 20 October 2009</td>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Bacteria Lysis==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Bacteria Lysis==</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Harvest the culture by centrifuge (13krpm*1.5min) followed by washing with 1ml PBS twice. Later steps should be done on the ice.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Harvest the culture by centrifuge (13krpm*1.5min) followed by washing with 1ml PBS twice. Later steps should be done on the ice.</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div># Re-suspend the pellet with PBS and protease inhibitor cocktail. </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div># Re-suspend the pellet with PBS <ins class="diffchange diffchange-inline">(five times volume of the pellet) </ins>and protease inhibitor cocktail. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Sonication for (5.5seconds+1second pulse)*10 minutes and protein solutions are obtained.</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div># Sonication for (5.5seconds+1second pulse)*10 minutes and protein solutions are obtained.</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"></td></tr>
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<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Competent Cell Preparation for Electro Transformation==</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>==Competent Cell Preparation for Electro Transformation==</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>* Materials</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>* Materials</div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*# Media: LB (Both liquid media and media containing agar. Add certain antibiotic if <del class="diffchange diffchange-inline">it is </del>necessary.) </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*# Media: LB (Both liquid media and media containing agar. Add certain antibiotic if necessary.) </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Buffers and Solutions: 10% Glycerol. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Buffers and Solutions: 10% Glycerol. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Special Equipments : EP tubes (1.5mL), micropipette tips, centrifugation bottles (polypropylene tubes, 50mL), graduated flask (250mL*2, 5mL*1), plates and test tubes. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Special Equipments : EP tubes (1.5mL), micropipette tips, centrifugation bottles (polypropylene tubes, 50mL), graduated flask (250mL*2, 5mL*1), plates and test tubes. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>* Steps</div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>* Steps</div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Sterilization </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Sterilization </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*## Including all materials in <del class="diffchange diffchange-inline">part2</del>. </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*## Including all materials in <ins class="diffchange diffchange-inline">materials section</ins>. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*## Caution (Remind): use some special marks to distinguish the sterilized materials from the unsterilized ones. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*## Caution (Remind): use some special marks to distinguish the sterilized materials from the unsterilized ones. </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Preparation after sterilization </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Preparation after sterilization </div></td></tr>
<tr><td colspan="2" class="diff-lineno">Line 29:</td>
<td colspan="2" class="diff-lineno">Line 29:</td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*## Decant LB containing agar into the plates.(If antibiotics are necessary, be sure that they are added when the media temperature is below 60 centigrade degree.) </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*## Decant LB containing agar into the plates.(If antibiotics are necessary, be sure that they are added when the media temperature is below 60 centigrade degree.) </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Streak the prepared strains onto the agar plates. Then incubate it at 37? for 10-16 hours. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Streak the prepared strains onto the agar plates. Then incubate it at 37? for 10-16 hours. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*# <del class="diffchange diffchange-inline">Overnight </del>pre-culture</div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*# <ins class="diffchange diffchange-inline">Pick up one single colony from the plate and </ins>pre-culture <ins class="diffchange diffchange-inline">it overnight()</ins></div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Take 0.5mL overnight culture to 50mL LB bottle. </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# Take 0.5mL overnight culture to 50mL LB bottle. </div></td></tr>
<tr><td class='diff-marker'>-</td><td style="background: #ffa; color:black; font-size: smaller;"><div>*# 37? shaking 100~120 min to O.D. 600<del class="diffchange diffchange-inline">=</del>0.45~0.6 </div></td><td class='diff-marker'>+</td><td style="background: #cfc; color:black; font-size: smaller;"><div>*# 37? shaking 100~120 min to O.D. <ins class="diffchange diffchange-inline">(wavelength </ins>600<ins class="diffchange diffchange-inline">) </ins>0.45~0.6 </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# On ice for 30min </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# On ice for 30min </div></td></tr>
<tr><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# 4000rpm 7min at 4? </div></td><td class='diff-marker'> </td><td style="background: #eee; color:black; font-size: smaller;"><div>*# 4000rpm 7min at 4? </div></td></tr>
</table>Jqq1002http://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=103047&oldid=prevYinanZhang at 10:27, 16 October 20092009-10-16T10:27:25Z<p></p>
<a href="http://2009.igem.org/wiki/index.php?title=Team:HKU-HKBU/Protocols&diff=103047&oldid=55039">Show changes</a>YinanZhang